Ju-Ai Ruan

Qorvo Inc.

  • Backside Via Process of GaN Device Fabrication

    Ju-Ai Ruan, Qorvo Inc.
    Craig Hall, Qorvo
    Celicia Della-Morrow, TriQuint Semiconductor
    Tom Nagle, Qorvo, Inc.
    Yinbao Yang, Qorvo, Inc.

  • 20.3 Some Process Development Issues for Ka-band GaN HEMT Individual Source Via (ISV)

    Yongjie Cui, Qorvo Inc.
    John Hitt, Qorvo Inc.
    Tso-Min Chou, Qorvo Inc.
    Shuoqi Chen, Qorvo Inc.
    David Gonzalez, Qorvo, Inc.
    Yinbao Yang, Qorvo, Inc.
    Trish Smith, Qorvo Inc.
    Ju-Ai Ruan, Qorvo Inc.
    Vivian Li, Qorvo Inc.
    Cathy Lee, Qorvo Inc.
    Andrew Ketterson, Qorvo Inc.
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