Kai Fu

Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science

  • 9.3 Compatibility of AlN/SiNx Passivation Technique with High-Temperature Process

    Mengyuan Hua, The Hong Kong University of Science and Technology
    Yunyou Lu, The Hong Kong University of Science and Technology
    Shenghou Liu, Xiamen San'an Integrated Circuit Co., Ltd.
    Cheng Liu, Xiamen San'an Integrated Circuit Co., Ltd.
    Kai Fu, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science
    Yong Cai, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science
    Baoshun Zhang, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Science
    Kevin J. Chen, The Hong Kong University of Science and Technology
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