Lou Pagentine

Qorovo, Inc

  • 6a.5 Temporary Bonding for Backside Processing of 150-mm SiC Wafers

    Ramachandran Trichur
    Jayson Cooper
    Molly Hladik, Brewer Science, Inc
    Lou Pagentine, Qorovo, Inc
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  • 7b.4 Using Six-Sigma Methodology to Reduce Metal-Insulator-Metal Capacitance Density Variance

    Jing Yao, Qorvo, Inc
    Lou Pagentine, Qorovo, Inc
    Dan Groft, Qorvo, Inc
    Pam Worsley, Qorvo, Inc
    Zach Reitmeier, Qorvo, Inc
    Patrick Carroll, Qorvo, Inc
    Download Paper