M. S. Goorsky

University of California, Los Angeles

  • 12.0.7.2024 Lapping and Chemical Mechanical Polishing of wide and ultra-wide bandgap semiconductors

    K. Pan, University of California Los Angeles
    K. Huynh, University of California, Los Angeles
    M.S. Goorsky, University of California, Los Angeles
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  • 12.0.10.2024 Large-Scale Thin-Film 128° Y-cut LiNbO3 on Sapphire via Wafer Bonding

    M. E. Liao, Apex Microdevices
    L. Matto, University of California Los Angeles
    K. Huynh, University of California, Los Angeles
    N. Ravi, University of California Los Angeles
    Y. Long, University of California Los Angeles
    P. J. Shah, Apex Microdevices
    M. S. Goorsky, University of California, Los Angeles
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