Student Presentation
M.S. Goorsky
University of California, Los Angeles
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Engineered Substrates: Alternative Technologies using Materials Integration
M.S. Goorsky, University of California, Los AngelesM. Jackson, UCLAM. Joshi, UCLAC. Ventosa, UCLAX. Kuo, UCLAD. Fong, UCLA -
May 12, 2022 // 3:20pm
18.6 Chemical Mechanical Polishing of β-Ga2O3
M.S. Goorsky, University of California, Los AngelesM. E. Liao, University of California, Los Angeles, CA USAK. Huynh, University of California, Los AngelesW. Olsen, University of California, Los Angeles, CA USAX. Huang, Argonne National LaboratoryM. Wojcik, Argonne National LaboratoryJ. C. Gallagher, U.S. Naval Research LaboratoryY. Wang, University of California, Los Angeles, CA USADownload Paper -
May 12, 2022 // 3:20pm
18.18 Reduction in Thermal Boundary Conductance of Annealed Direct Wafer Bonded GaN|Si Heterojunction Interfaces
K. Huynh, University of California, Los AngelesM. E. Liao, University of California, Los Angeles, CA USAV. Dragoi, EV GroupEric Guiot, SOITECRaphael Caulmilone, SOITECM.S. Goorsky, University of California, Los AngelesX. Yan, University of California IrvineT. Pfeifer, University of Virginia CharlottesvilleN. Razek, EV Group and R-Ray MedicalX. Pan, SoitecP. E. Hopkin, University of Virginia CharlottesvilleJ. Tomko, University of Virginia CharlottesvilleDownload PaperStudent Presentation
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12.0.7.2024 Lapping and Chemical Mechanical Polishing of wide and ultra-wide bandgap semiconductors
K. Pan, University of California Los AngelesK. Huynh, University of California, Los AngelesM.S. Goorsky, University of California, Los AngelesLoading... -
12.0.10.2024 Large-Scale Thin-Film 128° Y-cut LiNbO3 on Sapphire via Wafer Bonding
M. E. Liao, Apex MicrodevicesL. Matto, University of California Los AngelesK. Huynh, University of California, Los AngelesN. Ravi, University of California Los AngelesY. Long, University of California Los AngelesP. J. Shah, Apex MicrodevicesM. S. Goorsky, University of California, Los AngelesLoading...