Wet-etching issues in type-II DHBT process fabricated by standard triple-mesa wet-etching have been identified and reported in this paper. For comparison, devices fabricated by hybrid-etching with incorporation of inductively-coupled-plasma (ICP) are also present. With better uniformity and yield, hybrid-etching process can potentially lead to a more reliable and reproducible process for 5G power amplifier application.
Milton Feng
University of Illinois Urbana-Champaign
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19.2 Design and Fabrication of High-Speed PIN Photodiodes for 50 Gb/s Optical Fiber Links
Download PaperArdy Winoto, University of Illinois at Urbana ChampaignYu-Ting Peng, University of Illinois at Urbana ChampaignMilton Feng, University of Illinois Urbana-Champaign -
19.3 40 Gb/s VCSELs Test Data Collection, Analysis, and Process Problem Identification
Download PaperJunyi Qiu, University of Illinois at Urbana-ChampaignHsiao-Lun Wang, University of Illinois at Urbana-ChampaignCurtis Wang, University of Illinois at Urbana-ChampaignXin Yu, University of Illinois at Urbana-ChampaignMilton Feng, University of Illinois Urbana-Champaign -
Wet-etching Process Problem Identification in Type-II InP DHBT for 5G Power Application
Milton Feng, University of Illinois Urbana-ChampaignYu-Ting Peng, University of Illinois at Urbana ChampaignXin Yu, University of Illinois at Urbana-ChampaignDownload Paper -
6a.2 Inductively Coupled Plasma Dry Etching Process Development for > 50 Gb/s 850 nm Oxide-Confined VCSELs
Download PaperMichael LiuCurtis Wang, University of Illinois at Urbana-ChampaignMilton Feng, University of Illinois Urbana-Champaign -
10a.2 Nonalloyed Refractory Metals for Self-Aligned InP HBT Emitter Contacts with InAs/InGaAs Emitter Cap
Download PaperArdy Winoto, University of Illinois at Urbana ChampaignJunyi Qiu, University of Illinois at Urbana-ChampaignMilton Feng, University of Illinois Urbana-Champaign -
12.8 Microwave Equivalent Circuit Modeling of 28 GHz Modulated 850 nm Oxide-Confined VCSELs
Download PaperCurtis Wang, University of Illinois at Urbana-ChampaignMichael LiuMilton Feng, University of Illinois Urbana-Champaign