Minkar Chen

Global Communications Seminconductor, LLC

  • Methods for Removing TiOx Residue from Au Bond Pad

    Lena Luu, Global Communications Semiconductor, LLC
    Minkar Chen, Global Communications Seminconductor, LLC
    Frank Monzon, Global Communications Semiconductors, Inc.

  • 12.3 NiCr Sheet Resistance Adjustment During Wafer Fabrication Process

    Lena Luu, Global Communications Semiconductor, LLC
    Minkar Chen, Global Communications Seminconductor, LLC
    Alex Vigo, Global Communications Seminconductor, LLC
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