N. Collaert

Imec

  • 4.2.1.2024 (Invited) Silicon Meets Compound Semiconductors: Pioneering Wireless Communications

    N. Collaert, Imec
    R. Alcotte, Imec
    A. Alian, Imec
    M. Asad, Imec
    I. Bagal, Imec
    S. Banerjee, imec
    G. Boccardi, Imec
    P. Cardinael, Imec and Université catholique de Louvain
    I. Comart, imec & Vrije Universiteit Brussels
    D. Desset, Imec
    R. ElKashlan, Imec
    F. Filice, Imec
    G. Gramegna, Imec
    H. Jafarpoorchekab, Imec
    A. Khaled, Imec
    A. Kumar, Imec
    B. Kunert, Imec
    Y. Mols, Imec
    B. O’Sullivan, Imec
    S. Park, Imec
    U. Peralagu, Imec
    N. Pinho, Imec
    A. Rathi, Imec
    A. Sibaja-Hernandez, Imec
    S. Sinha, Imec
    D. Smellie, Imec
    X. Sun, Imec
    A. Vais, Imec
    B. Vanhouche, Imec
    B. Vermeersch, Imec
    D. Xiao, Imec
    S. Yadav, Imec
    D. Yan, Imec
    H. Yu, Imec
    Y. Zhang, Imec
    J. Van Driessche, Imec
    P. Wambacq, Imec
    M. Peeters, Imec
    B. Parvais, imec & Vrije Universiteit Brussels

    [embeddoc url=”https://csmantech.org/wp-content/uploads/2024/06/4.2.1.2024-Silicon-Meets-Compound-Semiconductors.pdf” download=”all”]

  • 4.2.3.2024 A monolithic III-V on Si integration technology utilizing 300mm CMOS platform

    G. Boccardi, Imec
    A. Vais, Imec
    A. Kumar, Imec
    S. Yadav, Imec
    Y. Mols, Imec
    R. Alcotte, Imec
    L. Witters, Imec
    J. De Backer, Imec
    A. Mingardi, Imec
    A. Milenin, Imec
    K. Vandersmissen, Imec
    N. Heylen, Imec
    K. Ceulemans, Imec
    D. Goossens, Imec
    F. Sebaai, Imec
    J-P Soulié, Imec
    R. Langer, Imec
    B. Kunert, Imec
    B. Parvais, imec vzw, Leuven, Belgium
    N. Collaert, Imec

    [embeddoc url=”https://csmantech.org/wp-content/uploads/2024/06/4.2.3.2024-A-monolithic-III-V-on-Si-integration-technology-utilizing-300mm-CMOS-platform.pdf” download=”all”]