Abstract
Coherent pluggable optics at 800 Gb/s and beyond are set to play a dominant role in optical networks over the next decade.
Infinera’s pluggable solutions are based on a monolithically integrated InP-based photonic integrated circuit (PIC), combining devices and functions required for a coherent optical transceiver. We will discuss the architecture and performance of several generations of InP-based PICs. Increased complexity in chip functionality has resulted in a need for increased fabrication complexity from III-V epitaxy, through wafer fab, die fab, and test. Through continuous learning and improvement, Infinera has fine-tuned the essential elements to successfully manufacture high-performance InP-based PICs. We will discuss manufacturing capability along with relevant yield and production metrics highlighting the manufacturability and scalability of this platform for pluggable components.
Recent industry trends have opened new and exciting markets where InP PICs offer benefits unmatched by any other technology. To meet these even higher volume manufacturing demands Infinera is investing in improved process technology and higher production capacity. We will discuss key challenges associated with this transition, and the outlook for further adoption of PIC technology.
Peter Debackere
Infinera Corporation
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May 02, 2019 // 9:00am – 9:30am
13.2 Volume Manufacturing of Highly Integrated System-On-Chip (SOC) InP-Based Photonic Integrated Circuits
Download PaperSteve Stockton, Infinera CorporationFred Kish, North Carolina State UniversitySteve Maranowski, Infinera CorporationPeter Debackere, Infinera CorporationAdam James, Infinera CorporationAndrew Dentai, Infinera CorporationPaul Liu, Infinera CorporationPayam Abolghasem, Infinera CorporationNikhil Modi, Infinera CorporationBala Vaddepaty, Infinera CorporationPeter Evans, Infinera CorporationVikrant Lal, Infinera CorporationGloria Hoefler, Infinera CorporationJianping Zhang, Infinera CorporationMehrdad Ziari, Infinera Corporation -
Manufacturing Progress for InP-based 500 Gbps Photonic Integrated Circuits
Download PaperRichard P. SchneiderJr., Naval Research LaboratoryJacco L. PleumeekersDamien J. H. LambertPeter W. EvansAndrew G. DentaiPaul Liu, Infinera CorporationJon RossiScott CraigMargherita LaiVikrant Lal, Infinera CorporationNaksup KimEva StrzeleckaPavel StudenkovAdam James, Infinera CorporationScott CorzineKuan-Pei YapPeter Debackere, Infinera CorporationShashank AgasheJeffrey GlickChristopher HillQuisheng ChenWayne WilliamsSanjeev MurthyRanjani MuthiahMark MisseyScott DeMarsMehrdad Ziari, Infinera CorporationMasaki KatoRadhakrishnan NagarajanArnold ChenSheila HurttFred Kish, North Carolina State University -
11A.2 – Recent Trends in the Manufacturing of InP Photonic Integrated Circuits P.
Peter Debackere, Infinera CorporationS. Stockman, Infinera CorporationD. Casado, Infinera CorporationVikrant Lal, Infinera CorporationPeter Evans, Infinera CorporationSteve Maranowski, Infinera CorporationMehrdad Ziari, Infinera CorporationJ. Zhang, Dow Corning CorporationF. Steranka, Infinera Corporation