Peter Evans

Infinera Corporation
  • May 02, 2019 // 9:00am – 9:30am

    13.2 Volume Manufacturing of Highly Integrated System-On-Chip (SOC) InP-Based Photonic Integrated Circuits

    Steve Stockton, Infinera Corporation
    Fred Kish, North Carolina State University
    Steve Maranowski, Infinera Corporation
    Peter Debackere, Infinera Corporation
    Adam James, Infinera Corporation
    Andrew Dentai, Infinera Corporation
    Paul Liu, Infinera Corporation
    Payam Abolghasem, Infinera Corporation
    Nikhil Modi, Infinera Corporation
    Bala Vaddepaty, Infinera Corporation
    Peter Evans, Infinera Corporation
    Vikrant Lal, Infinera Corporation
    Gloria Hoefler, Infinera Corporation
    Jianping Zhang, Infinera Corporation
    Mehrdad Ziari, Infinera Corporation
    Download Paper

  • 11A.2 – Recent Trends in the Manufacturing of InP Photonic Integrated Circuits P.

    Peter Debackere, Infinera Corporation
    S. Stockman, Infinera Corporation
    D. Casado, Infinera Corporation
    Vikrant Lal, Infinera Corporation
    Peter Evans, Infinera Corporation
    Steve Maranowski, Infinera Corporation
    Mehrdad Ziari, Infinera Corporation
    J. Zhang, Dow Corning Corporation
    F. Steranka, Infinera Corporation

    11A.2 Final.2025

    Abstract
    Coherent pluggable optics at 800 Gb/s and beyond are set to play a dominant role in optical networks over the next decade.
    Infinera’s pluggable solutions are based on a monolithically integrated InP-based photonic integrated circuit (PIC), combining devices and functions required for a coherent optical transceiver. We will discuss the architecture and performance of several generations of InP-based PICs. Increased complexity in chip functionality has resulted in a need for increased fabrication complexity from III-V epitaxy, through wafer fab, die fab, and test. Through continuous learning and improvement, Infinera has fine-tuned the essential elements to successfully manufacture high-performance InP-based PICs. We will discuss manufacturing capability along with relevant yield and production metrics highlighting the manufacturability and scalability of this platform for pluggable components.
    Recent industry trends have opened new and exciting markets where InP PICs offer benefits unmatched by any other technology. To meet these even higher volume manufacturing demands Infinera is investing in improved process technology and higher production capacity. We will discuss key challenges associated with this transition, and the outlook for further adoption of PIC technology.