Pi-Hsia Wang

  • Device Characteristics Analysis of GaAs/InGaP HBT Power Cells Using Conventional Through Wafer Via Process and Copper Pillar Bump Process

    Hsiu-Chen Chang
    Shu-Hsiao Tsai, WIN Semiconductors Corp
    Cheng-Kuo Lin, WIN Semiconductors Corp
    Tim Hsiao
    Steven Chou
    C. Chen, Momentive Technologies
    Pi-Hsia Wang
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