Pradeep Waduge

MACOM Technology
  • Thermal Stability, Uniformity and Electrical Properties of Sputtered and Evaporated NiCr Thin Film Resistors

    Peter Ersland, MACOM Technology
    Pradeep Waduge, MACOM Technology
    Maik Katko, Macom Technology Solutions
    Lisza Elliot, MACOM

    NiCr is one of the most commonly used resistive materials for fabricating precision thin film resistors due to its wide range of resistivity, low temperature coefficient of resistivity (TCR), and high stability of electrical properties. NiCr thin film resistors are usually manufactured by evaporation or sputtering. It is well known that thermal evaporation of NiCr from a finite mass of molten alloy causes a film composition change away from the composition of the source, as well as film composition changes from run to run. Some electrical properties of NiCr thin film resistors strongly depend on the film microstructure (i.e. Ni:Cr ratio) in addition to its spatial geometry (film thickness) and the deposition parameters in the evaporator. As a result, while film thickness and deposition parameters are well controlled, often time resistivity of evaporated NiCr thin film resistors goes out of spec. Therefore, in this paper we are investigating the possibility of replacing the evaporated NiCr thin films with the sputtered NiCr thin films as resistors. Here, we present a comprehensive study of NiCr thin film resistors developed using DC sputtering system and discuss the effects of sputtering process parameters and substrate conditions on film microstructure, TCR and electrical properties.

    Download Paper
  • May 12, 2022 // 3:20pm

    18.2 Reduced Metal Spits in E-beam Metal Evaporation via Improved Crucible Liner-Hearth Power Dissipation

    Pradeep Waduge, MACOM Technology
    Loader Loading...
    EAD Logo Taking too long?

    Reload Reload document
    | Open Open in new tab

    Download [953.42 KB]

    Download Paper
  • 11.1.3.2024 Novel Nichrome Thin Film Resistor Fabrication Approach in E-Beam Evaporation for High Volume Semiconductor Manufacturing

    Pradeep Waduge, MACOM Technology
    Debdas Pal, MACOM Technology
    Peter Ersland, MACOM Technology
    Sam June, MACOM Technology
    Chris Samson, MACOM Technology
    Vince Hoang, MACOM Technology
    Shanali Weerasinghe, MACOM Technology
    Loader Loading...
    EAD Logo Taking too long?

    Reload Reload document
    | Open Open in new tab

    Download [480.20 KB]