Qizhi He

  • Final Module Yield Improvement by Increasing the Adhesion of SU8 to Microelectronic Devices using a DMAIC approach

    Jan Campbell
    Martin Ivie
    Qizhi He
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  • Back to the Future: How Implementing Retro-Style Processing Can be an Improvement

    Martin Ivie
    Jan Campbell
    Qizhi He
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  • The Use of a Structured Approach to Solve Yield Limiting Defects in a Compound Semiconductor Factory

    Jan Campbell
    Qizhi He
    Howie Yang, TriQuint Semiconductor,TX
    Martin Ivie
    John Gibbon, Qorvo
    Darrel Lupo, TriQuint Semiconductor,TX
    Dario Nappa, TriQuint Semiconductor,TX
    Jerry Beene, TriQuint Semiconductor,TX

  • ADHESION CHARACTERIZATION OF PHOTO-DEFINABLE EPOXIES ON HIGH ASPECT RATIO STRUCTURES FOR HIGH PERFORMANCE APPLICATIONS

    Jan Campbell
    Qizhi He