8.2.2023-Diamond-Metal Composite Package – CS Mantech Paper Final

4B.1 Final.2025

Abstract
TO packaging continues to replace air cavity ceramic
as a lower cost package for high power RF devices.
Advances in the plastic overmold materials and process
along with wire bonding have enabled its use with the
increasing power demands of GaN devices. This paper will
describe these advances and the interactions with GaN
devices that have led to a lower cost, high performing, and
reliable packaging solution.