Robert Patti

Nhanced Semiconductor
  • May 01, 2019 // 11:40am – 12:10pm

    8.4 CMP Process Development on III-V Substrates for 3D Heterogeneous Integration

    Miguel Urteaga, Teledyne Scientific Company
    Andy Carter, Teledyne Scientific Company
    Sangki Hong, Nhanced Semiconductor
    Robert Patti, Nhanced Semiconductor
    Carl Petteway, Nhanced Semiconductor
    Gill Fountain, Nhanced Semiconductor
    Download Paper

  • 7.1.1.2024 Advanced Packaging, Heterogeneous Integration, and Foundry 2.0

    Robert Patti, Nhanced Semiconductor

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