11A.2 Final.2025

Abstract
Coherent pluggable optics at 800 Gb/s and beyond are set to play a dominant role in optical networks over the next decade.
Infinera’s pluggable solutions are based on a monolithically integrated InP-based photonic integrated circuit (PIC), combining devices and functions required for a coherent optical transceiver. We will discuss the architecture and performance of several generations of InP-based PICs. Increased complexity in chip functionality has resulted in a need for increased fabrication complexity from III-V epitaxy, through wafer fab, die fab, and test. Through continuous learning and improvement, Infinera has fine-tuned the essential elements to successfully manufacture high-performance InP-based PICs. We will discuss manufacturing capability along with relevant yield and production metrics highlighting the manufacturability and scalability of this platform for pluggable components.
Recent industry trends have opened new and exciting markets where InP PICs offer benefits unmatched by any other technology. To meet these even higher volume manufacturing demands Infinera is investing in improved process technology and higher production capacity. We will discuss key challenges associated with this transition, and the outlook for further adoption of PIC technology.