Shih-Hui Huang

WIN Semiconductors Corp

  • Method for Forming Through Wafer Vias in GaN on SiC Devices and Circuits

    Chia-Hao Chen, WIN Semiconductors Corp
    Yu-Wei Chang, WIN Semiconductors Corp
    Ming-Hung Weng, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Ricky Chang, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Shih-Hui Huang, WIN Semiconductors Corp
    Fraser Wang, WIN Semiconductors Corp
    Yi-Feng Wei, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Stanley Hsieh, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
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  • Development and Control of a 0.25μm Gate Process Module for AlGaN/GaN HEMT Production

    Wei-Chou Wang, WIN Semiconductors Corp.
    Chia-Hao Chen, WIN Semiconductors Corp
    Jhih-Han Du, WIN Semiconductors Corp
    Ming-Hung Weng, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Willie Huang
    Ricky Chang, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Shih-Hui Huang, WIN Semiconductors Corp
    Yi-Feng Wei, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Stanley Hsieh, I-Te Cho, Walter Wohlmuth WIN Semiconductors Corp.
    Michael Casbon
    Paul J. Tasker
    Wen-Kai Wang, WIN Semiconductors Corp.
    I-Te Cho, WIN Semiconductors Corp.
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  • 14.12 Enhancing the Manufacturability and Evolving the Technology of GaN on SiC Back-Side Vias

    Chia-Hao Chen, WIN Semiconductors Corp
    Yu-Wei Chang, WIN Semiconductors Corp
    Shih-Hui Huang, WIN Semiconductors Corp
    Fraser Wang, WIN Semiconductors Corp
    Benny Ho, WIN Semiconductors Corp
    Walter Wohlmuth, Vanguard International Semiconductor Corporation, Taiwan
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