Skyworks Solutions

  • A Mathematical Model to Determine the Impact of Through-Wafer-Vias on Backside Plating Thickness

    Jens Riege, Skyworks Solutions, Inc.
    Skyworks Solutions
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  • ALD HfO2, Al2O3, and PECVD Si3N4 as MIM Capacitor Dielectric for GaAs HBT Technology

    Jiro Yota
    Kai Kwok
    Skyworks Solutions
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  • An E-beam Evaporation Deposition Process for Tantalum Nitride Thin Film Resistors

    Lam Luu-Henderson, Skyworks Solutions Inc.
    Shiban Tiku, Skyworks Solutions, Inc.
    Hong Shen
    Richard Bingle
    Daniel Weaver
    Gary Hu
    Cristian Cismaru, Skyworks Solutions, Inc.
    Mike Sun, Skyworks Solutions, Inc.
    Skyworks Solutions
    formerly of Skyworks Solutions
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