Skyworks Solutions

  • A Mathematical Model to Determine the Impact of Through-Wafer-Vias on Backside Plating Thickness

    Jens Riege, Skyworks Solutions, Inc.
    Skyworks Solutions
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  • ALD HfO2, Al2O3, and PECVD Si3N4 as MIM Capacitor Dielectric for GaAs HBT Technology

    Jiro Yota
    Kai Kwok
    Skyworks Solutions
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  • An E-beam Evaporation Deposition Process for Tantalum Nitride Thin Film Resistors

    Lam Luu-Henderson
    Shiban Tiku, Skyworks Solutions, Inc.
    Hong Shen
    Richard Bingle
    Daniel Weaver
    Gary Hu
    Cristian Cismaru, Skyworks Solutions, Inc.
    Mike Sun, Skyworks Solutions, Inc.
    Skyworks Solutions
    formerly of Skyworks Solutions
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