T. Shimatsu

FRIS, Tohoku University

  • 8.5.2023 Atomic Diffusion Bonding Using AlN and Al2O3 Films

    T. Saito, Canon ANELVA Corporation
    H. Makita, Canon ANELVA Corporation
    Y. Suzuki, Canon ANELVA Corporation
    Y. Kozuka, Canon ANELVA Corporation
    A. Muraoka, Canon ANELVA Corporation
    H. Fukunaga, FRIS, Tohoku University
    M. Uomoto, FRIS, Tohoku University
    T. Shimatsu, FRIS, Tohoku University

    8.5.2023 Extended abstract Saito Canon ALNELVA_final ver