Wen-Fu Yu

  • Layout Practices for Die Size Reduction on InGaP/GaAs HBT MMICs for Handset Power Amplifier Applications

    Shu-Hsiao Tsai, WIN Semiconductors Corp
    Rong-Hao Syu
    Yu-Ling Chen
    Wen-Fu Yu
    Cheng-Kuo Lin, WIN Semiconductors Corp
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