Xin Yu

University of Illinois at Urbana-Champaign
  • Wet-etching Process Problem Identification in Type-II InP DHBT for 5G Power Application

    Milton Feng, University of Illinois Urbana-Champaign
    Yu-Ting Peng, University of Illinois at Urbana Champaign
    Xin Yu, University of Illinois at Urbana-Champaign

    Wet-etching issues in type-II DHBT process fabricated by standard triple-mesa wet-etching have been identified and reported in this paper. For comparison, devices fabricated by hybrid-etching with incorporation of inductively-coupled-plasma (ICP) are also present. With better uniformity and yield, hybrid-etching process can potentially lead to a more reliable and reproducible process for 5G power amplifier application.

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  • 19.3 40 Gb/s VCSELs Test Data Collection, Analysis, and Process Problem Identification

    Junyi Qiu, University of Illinois at Urbana-Champaign
    Hsiao-Lun Wang, University of Illinois at Urbana-Champaign
    Curtis Wang, University of Illinois at Urbana-Champaign
    Xin Yu, University of Illinois at Urbana-Champaign
    Milton Feng, University of Illinois Urbana-Champaign
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