Yu-Ting Peng

University of Illinois at Urbana Champaign
  • Wet-etching Process Problem Identification in Type-II InP DHBT for 5G Power Application

    Milton Feng, University of Illinois Urbana-Champaign
    Yu-Ting Peng, University of Illinois at Urbana Champaign
    Xin Yu, University of Illinois at Urbana-Champaign

    Wet-etching issues in type-II DHBT process fabricated by standard triple-mesa wet-etching have been identified and reported in this paper. For comparison, devices fabricated by hybrid-etching with incorporation of inductively-coupled-plasma (ICP) are also present. With better uniformity and yield, hybrid-etching process can potentially lead to a more reliable and reproducible process for 5G power amplifier application.

    Download Paper
  • 19.2 Design and Fabrication of High-Speed PIN Photodiodes for 50 Gb/s Optical Fiber Links

    Ardy Winoto, University of Illinois at Urbana Champaign
    Yu-Ting Peng, University of Illinois at Urbana Champaign
    Milton Feng, University of Illinois Urbana-Champaign
    Download Paper
  • 14.4 Process Optimization and Characterization of 25 GHz Bandwidth 850 nm P-i-N Photodetector for 50 Gb/s Optical Links

    Yu-Ting Peng, University of Illinois at Urbana Champaign
    Dufei Wu, University of Illinois at Urbana Champaign
    Ardy Winoto, University of Illinois at Urbana Champaign
    Download Paper
  • May 10, 2022 // 3:20pm

    10.5 Hybrid Etching Process in Sub-micron Type-II GaAsSb/InP DHBT for 5G and millimeter-wave Power Amplification

    Yu-Ting Peng, University of Illinois at Urbana Champaign
    Xin Yu, University of Illinois at Urbana-Champaign
    Milton Feng, University of Illinois, Urbana-Champaign
    Yulin He, University of Illinois Urbana-Champagne

     

     

     

    Download Paper