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5.4.2023 Gold-Assisted Deposition of a Material with Low Spitting by a New Carbon Removal Process
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4B.3 – Heat Resistance Improvement of Palladium Pre Plated Frames of Semiconductor Packaging with a New Additive for Nickel Plating
Abstract
We investigated methods for improving the solder wettability of lead frames that connect semiconductor chips to electronic devices. A newly developed Ni plating bath with a Ge additive provided excellent solder wettability to the Ni/Pd/Au protection layer on copper-lead frames, even after heat treatment at 400 °C. It was found that even when the Ni/Pd/Au plating films were heat treated, the diffusion of Cu and Ni was drastically suppressed because the recrystallization of the plated Ni layer was suppressed when the film was deposited with plating chemicals containing Ge.
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