Yuichiro Shindo

Matsuda Sangyo Co., Ltd.
  • 5.4.2023 Gold-Assisted Deposition of a Material with Low Spitting by a New Carbon Removal Process

    Taichi Ito, Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.
    Kiyofumi Kodera, Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.
    Yuichiro Shindo, Matsuda Sangyo Co., Ltd.

    5.4.2023_Ito_Gold Assisted Deposition of a Material with Low Spitting by a New Carbon Removal Process

  • 3.1.2.2024 Electrochemical Additive Selection for Non–Cyanide Gold Plating Bath for Uniform Thickness Gold Layer for GaAs Backside Metallization

    Shoei Mizuhashi, Matsuda Sangyo Co., Ltd.
    Yusuke Sato, Matsuda Sangyo Co., Ltd.
    Yuichiro Shindo, Matsuda Sangyo Co., Ltd.
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  • 11.1.5.2024 Electron-beam Deposition with Low- Spitting Platinum Source Material Improved by New Impurity Removal Processes

    Atsushi Kawashimo, Matsuda Sangyo Co., Ltd.
    Takahiro Kobayashi, Matsuda Sangyo Co., Ltd.
    Masatoshi Koyama, Osaka Institute of Technology
    Yuichiro Shindo, Matsuda Sangyo Co., Ltd.
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