Yuichiro Shindo
Matsuda Sangyo Co., Ltd.
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5.4.2023 Gold-Assisted Deposition of a Material with Low Spitting by a New Carbon Removal Process
Taichi Ito, Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.Kiyofumi Kodera, Precious Metals Materials Division, Matsuda Sangyo Co., Ltd.Yuichiro Shindo, Matsuda Sangyo Co., Ltd. -
3.1.2.2024 Electrochemical Additive Selection for Non–Cyanide Gold Plating Bath for Uniform Thickness Gold Layer for GaAs Backside Metallization
Shoei Mizuhashi, Matsuda Sangyo Co., Ltd.Yusuke Sato, Matsuda Sangyo Co., Ltd.Yuichiro Shindo, Matsuda Sangyo Co., Ltd.Loading...
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11.1.5.2024 Electron-beam Deposition with Low- Spitting Platinum Source Material Improved by New Impurity Removal Processes
Atsushi Kawashimo, Matsuda Sangyo Co., Ltd.Takahiro Kobayashi, Matsuda Sangyo Co., Ltd.Masatoshi Koyama, Osaka Institute of TechnologyYuichiro Shindo, Matsuda Sangyo Co., Ltd.Loading...