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  • 1: PLENARY

    Chair: David Via, AFRL

    • Compound Semiconductor Technology for Modern RF Modules: Status and Future Directions

      Daniel S. Green, DARPA
      Carl L. Dohrman, Booz Allen Hamilton
      Avinash S. Kane, Booz Allen Hamilton
      Tsu-Hsi Chang, HetInTec Corp
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    • Importance of High Frequency Compound Semiconductor Devices for Wireless Power Transfer using Direct-Current-Resonance System

      Tatsuya Hosotani, Murata Manufacturing Co., Ltd
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    • Strategies for Wide Bandgap, Inexpensive Transistors for Controlling High-Efficiency Systems

      Timothy D. Heidel, Advanced Research Projects Agency – Energy (ARPA-E) U.S. Department of Energy
      David Henshall, Advanced Research Projects Agency – Energy (ARPA-E) U.S. Department of Energy
      Pawel Gradzki, Booz Allen Hamilton
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