3.2.2021 Wafer-Level Packages for RF GaN Technologies & On-Wafer Humidity Test

Hermann Stieglauer, United Monolithic Semiconductors Germany
Klaus Riepe, United Monolithic Semiconductorss GmBH
Janina Moereke, United Monolithic Semiconductorss GmBH
Jan Grünenpütt, United Monolithic Semiconductors France
Hervé Blanck, United Monolithic Semiconductors
Daniel Sommer, United Monolithic Semiconductorss GmBH
Benoît Lambert, United Monolithic Semiconductors Germany
Jerome Van de Casteele, United Monolithic Semiconductorss SAS
Mehdy Neffati, United Monolithic Semiconductorss SAS
Ulli Hansen, MSG Lithoglas GmbH
Simon Maus, MSG Lithoglas GmbH
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