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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
May 11, 2022 // 4:50pm
12.2 Differences in SiC Wafer Thermal Conductivity from Face-to-Face Dependent on Polishing
Daniel Field, University of Bristol
Martin Kuball, University of Bristol
Filip Wach, University of Bristol
Student Presentation
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