A. Alian

Imec
  • May 10, 2022 // 2:40pm

    2.3 Advanced MOCVD Technology for RF-HEMT Growth on SEMI-Standard Large-Area (111) Silicon Substrates

    C. Mauder, AIXTRON SE
    H. Hahn, AIXTRON SE, Herzogenrath, Germany
    Z. Gao, AIXTRON SE
    M. Marx, AIXTRON SE, Herzogenrath, Germany
    T. Zweipfennig, RWTH Aachen University, Germany
    J. Ehrler, RWTH Aachen University, Germany
    H. Kalisch, RWTH Aachen University, Germany
    J. Bolton, AMO GmbH, Aachen Germany
    M. Lemme, AMO GmbH, Aachen Germany
    A. Alian, Imec
    B. Parvais, imec vzw, Leuven, Belgium
    M. Zhao, imec vzw, Leuven, Belgium
    Michael Heuken, AIXTRON SE
    A. Vescan, RWTH Aachen University, Germany

    [embeddoc url=”https://csmantech.org/wp-content/uploads/2023/09/2.3.2022-Advanced-MOCVD-Technology-for-RF-HEMT.pdf” download=”all”]

    Download Paper

  • 4.2.1.2024 (Invited) Silicon Meets Compound Semiconductors: Pioneering Wireless Communications

    N. Collaert, Imec
    R. Alcotte, Imec
    A. Alian, Imec
    M. Asad, Imec
    I. Bagal, Imec
    S. Banerjee, imec
    G. Boccardi, Imec
    P. Cardinael, Imec and Université catholique de Louvain
    I. Comart, imec & Vrije Universiteit Brussels
    D. Desset, Imec
    R. ElKashlan, Imec
    F. Filice, Imec
    G. Gramegna, Imec
    H. Jafarpoorchekab, Imec
    A. Khaled, Imec
    A. Kumar, Imec
    B. Kunert, Imec
    Y. Mols, Imec
    B. O’Sullivan, Imec
    S. Park, Imec
    U. Peralagu, Imec
    N. Pinho, Imec
    A. Rathi, Imec
    A. Sibaja-Hernandez, Imec
    S. Sinha, Imec
    D. Smellie, Imec
    X. Sun, Imec
    A. Vais, Imec
    B. Vanhouche, Imec
    B. Vermeersch, Imec
    D. Xiao, Imec
    S. Yadav, Imec
    D. Yan, Imec
    H. Yu, Imec
    Y. Zhang, Imec
    J. Van Driessche, Imec
    P. Wambacq, Imec
    M. Peeters, Imec
    B. Parvais, imec & Vrije Universiteit Brussels

    [embeddoc url=”https://csmantech.org/wp-content/uploads/2024/06/4.2.1.2024-Silicon-Meets-Compound-Semiconductors.pdf” download=”all”]