6A.1 Final.2025

Abstract
Traditional packaging technologies such as wire-bonding and lead-frames have served the compound semiconductor market well. As industry moves towards heterogeneous integration, there is an evolving need for advanced semiconductor packaging technologies for compound semiconductors. Extending these technologies towards the compound semiconductor market faces several challenges in terms of wafer sizes, packaging materials, thermal management, and reliability. This paper discusses advanced semiconductor packaging technologies, the heterogeneous integration roadmap, and the need for modelling technologies to support the packaging of compound semiconductors, their performance and reliability.