H. Watanabe
Institute of Materials and Systems for Sustainability, Nagoya University
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11.5.2023 GaN substrate cut-out process and GaN on GaN device thinning process with laser slicing
A. Tanaka, Institute of Materials and Systems for Sustainability, Nagoya UniversityK. Matsushima, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Aratani, Hamamatsu Photonics K.KK. Hara, Hamamatsu Photonics K.KD. Kawaguchi, Hamamatsu Photonics K.KH. Watanabe, Institute of Materials and Systems for Sustainability, Nagoya UniversityT. Kanemura, Institute of Materials and Systems for Sustainability, Nagoya UniversityY. Nagasato, MIRISE Technologies CorporationM. Nagaya, MIRISE Technologies CorporationYoshio Honda, Institute of Materials and Systems for Sustainability, Nagoya UniversityA. Wakejima, Nagoya Institute of TechnologyY. Ando, Institute of Materials and Systems for Sustainability, Nagoya UniversityS. Onda, Institute of Materials and Systems for Sustainability, Nagoya UniversityJ. Suda, Institute of Materials and Systems for Sustainability, Nagoya University