Kevin Riddell

SPTS, Newport, UK

  • 20.12 Backside Via Process with Defect Free Sidewalls for GaN MMIC Applications

    Kyu Jun Cho, ETRI (Electronics and Telecommunications Research Institute)
    Byong Gue Min, ETRI (Electronics and Telecommunications Research Institute)
    Ho Kyun Ahn, Electronics and Telecommunications Research Institute
    Hae Cheon Kim, ETRI (Electronics and Telecommunications Research Institute)
    Hyung Sup Yoon, Electronics and Telecommunications Research Institute
    Hyun-Wook Jung, ETRI (Electronics and Telecommunications Research Institute)
    Jae-Won Do, ETRI (Electronics and Telecommunications Research Institute)
    Min Jeong Shin, ETRI (Electronics and Telecommunications Research Institute)
    Sung-Jae Chang, ETRI (Electronics and Telecommunications Research Institute)
    Jong Won Lim, Electronics and Telecommunications Research Institute
    Anthony Barker, SPTS Technologies Ltd.
    Alex Wood, SPTS Technologies Ltd.
    Kevin Riddell, SPTS, Newport, UK
    Gordon Horsley, SPTS Technologies Ltd.
    Dave Thomas, SPTS Technologies Ltd.
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  • May 12, 2022 // 3:20pm

    18.13 Rounded Base Corners in SiC Trenches for Power MOSFETs

    Kevin Riddell, SPTS, Newport, UK
    A. Croot, KLA Corporation (SPTS Division)
    C. Bolton, SPTS, Newport, UK
    B. Jones, Swansea University
    F. Monaghan, Swansea University, Swansea, UK
    J. Mitchell, KLA Corporation (SPTS Division)
    M. R. Jennings, Swansea University, Swansea, UK
    O. J. Guy, Centre for Integrative Semiconductor Materials (CISM),
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  • 9.2.2021 State-of-the-Art Etch and Deposition Processing of highly doped ScAlN for 5G and Wi-Fi Filter Applications

    Anthony Barker, SPTS Technologies Ltd.
    Kevin Riddell, SPTS, Newport, UK
    Alex Wood, SPTS Technologies Ltd.
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