A nanoindentation induced blistering method has been used to extract the GaN/diamond interfacial toughness (adhesion energy) from four types of GaN-on-diamond samples with varying SiNx interlayer thicknesses. The mode I energy release rate (GIC) was quantified and is presented. Additionally, transient thermoreflectance has been used to measure the thermal boundary resistance (TBR) between the GaN and the diamond substrate. It was found that a thin SiNx interlayer resulted in a lower TBR (15 m2 K GW-1) whilst maintaining a reasonable interfacial toughness (1.4±0.5 J m-2). For interlayers of a similar thickness, samples with a high interfacial toughness and high residual stresses in the GaN had a smaller TBR. This indicates that the intrinsic interfacial characteristics that enhanced the interfacial toughness could be beneficial in improving the TBR.
Martin Kuball
University of Bristol
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GaN-on-diamond: the correlation between interfacial toughness and thermal resistance
Daniel Francis, Akash Systems, San Francisco, CA, USADaniel Field, University of BristolCaho Yuan, University of BristolRoland Simon, Thermap SolutionsDaniel Twitchen, Element Six Ltd.Firooz Faili, Element Six Technologies, Santa Clara, CADong Liu, University of Oxford, University of BristolMartin Kuball, University of BristolDownload Paper -
May 12, 2022 // 3:20pm
18.12 GaN-on-Si Membranes for Power Device Applications: Stress Evolution throughout Fabrication
Jerome Cuenca, Cardiff University, Cardiff, UKOliver Williams, Cardiff University, Cardiff, UKMartin Kuball, University of BristolDownload PaperLoading... -
May 11, 2022 // 5:30pm
12.4 Novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment in packaged devices
Zeina Abdallah, University of BristolNathawat Poopakdec, University of Bristol, Bristol, UK and Navaminda Kasatriyadhiraj Royal Air Force AcademnyMartin Kuball, University of BristolJames Pomeroy, University of BristolDownload PaperLoading... -
May 12, 2022 // 11:30am
14.3 Dynamic Ron in AlGaN/GaN Structure with Different Layer Thickness
Hyun-Seop Kim, University of Bristol, Bristol, UKHassan Hirshy, IQE, Cardiff, UKAndrew Withey, Nexperia Newport Wafer Fab, Newport, UKRobert Harper, Compound Semiconductor Centre, Cardiff, UKSam Evans, Nexperia Newport Wafer Fab, Newport, UKMartin Kuball, University of BristolMichael J Uren, University of BristolDownload PaperLoading... -
12.1.2023 Thermal management in GaN-devices for increased power density
Mohamadali Malakoutian, Stanford University, Stanford, CA,Xiang Zheng, University of Bristol, BristolMartin Kuball, University of BristolS. Chowdhury, Stanford University, Stanford, CA; University of Bristol, Bristol, UK -
12.3.2023 Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly
Zeina Abdallah, University of BristolJames Pomeroy, University of BristolNicolas Blasakis, Adamant Composite Ltd.Athanasios Baltopoulos, Adamant Composite Ltd.Antonios Vavouliotis, Adamant Composite Ltd.Martin Kuball, University of Bristol -
15.2.2023 Selective Area Growth of B-Ga2O3
Arpit Nandi, University of BristolIndraneel Sanyal, University of BristolMartin Kuball, University of Bristol -
10.1.3.2024 3D Diamond Growth for GaN Cooling and TBR Reduction
Daniel Francis, Akash Systems, San Francisco, CA, USASai Charan Vanjari, University of BristolXiaoyang Ji, University of BristolTatyana Feygelson, U. S. Naval Research LaboratoryJoseph Spencer, U.S. Naval Research LaboratoryHannah N. Masten, National Research Council Postdoctoral Fellow, Residing at NRLAlan Jacobs, U.S. Naval Research LaboratoryJames Spencer Lundh, National Research Council Postdoctoral Fellow, Residing at NRLMarko Tadjer, U.S. Naval Research LaboratoryTravis J. Anderson, U.S. Naval Research LaboratoryKarl D. Hobart, U.S. Naval Research LaboratoryBradford Pate, Naval Research LaboratoryJames Pomeroy, University of BristolMatthew Smith, University of BristolMartin Kuball, University of BristolLoading... -
10.1.4.2024 Thermal Dissipation Enhancement Using a Metal-Diamond Composite Heat Spreaders in High-Power RF MMICs
Zeina Abdallah, University of BristolJames Pomeroy, University of BristolMartin Kuball, University of BristolLoading... -
11.2.2.2024 Mapping of Local Threshold Voltage in AlGaN/GaN HEMTs
Anjali Anjali, University of BristolJames Pomeroy, University of BristolJr-Tai Chen, SweGaN ABMartin Kuball, University of BristolLoading... -
11.2.3.2024 Time-Dependent Conduction Mechanisms in Superlattice Layers on 200 mm Engineered Substrates
Zequan Chen, University of BristolPeng Huang, University of BristolIndraneel Sanyal, University of BristolMatthew Smith, University of BristolMichael J Uren, University of BristolA. Vohra, imec, Leuven, BelgiumBenoit Bakeroot, imec, Leuven, Belgium and CMST, imec & Ghent University, Ghent, BelgiumMartin Kuball, University of BristolLoading...