4.2.2.2024 Heterogeneously Integrated Compound Semiconductors on Large-Diameter
Michael McGivney
Aeluma, Inc.
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4.2.2.2024 Heterogeneously Integrated Compound Semiconductors on Large-Diameter Substrates for Scaling to Consumer Market Volumes
Jonathan Klamkin, Aeluma, Inc.Matthew Dummer, Aeluma, Inc.Bei Shi, Aeluma, Inc.Bowen Song, Aeluma, Inc.Simone Suran Brunelli, Aeluma, Inc.Michael McGivney, Aeluma, Inc.Robert Buller, Aeluma, Inc.Wilmer Barraza, Aeluma, Inc. -
6A.2 – Heterogeneous Integration of Large-Area InGaAs SWIR Photodetectors on 300 mm CMOS-Compatible Si Substrates
B. Shi, Aeluma, Inc.Matthew Dummer, Aeluma, Inc.Michael McGivney, Aeluma, Inc.Simone Suran Brunelli, Aeluma, Inc.D. Oakley, Aeluma, Inc.Jonathan Klamkin, Aeluma, Inc.Abstract
We demonstrate the heterogeneous integration of SWIR large-area InGaAs photodetectors and pixelated photodetector arrays on 300 mm CMOS-compatible Si (100) substrates through direct heteroepitaxy. The devices exhibit low dark current, high responsivity, low capacitance, and high quantum efficiency at shortwave infrared wavelengths.