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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
Olaf Hohlfeld
Infineon Technologies AG
8.1.2023 Perspective of power module packaging technology
Olaf Hohlfeld, Infineon Technologies AG
8.1.2023-Perspective of power module packaging technology-Hohlfeld
