2026 Call for Papers Abstract submission date has been extended to November 20th.
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  • 7b: PACKAGING

    • Electrical, Thermal, Reliability and Cost Considerations for Millimeter-Wave Surface Mount Packages

    • Methods for Removing TiOx Residue from Au Bond Pad

      Lena Luu, Global Communications Semiconductor, LLC
      Minkar Chen, Global Communications Seminconductor, LLC
      Frank Monzon, Global Communications Semiconductors, Inc.

    • Manufacturing of Cu-pillar Bump for III-V MMIC Thermal Management

      T. Hsiao; G. Chen; S. Chou; H. Liao, WIN Semiconductors Corp.