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  • 7a: Thermal Management

    • 7a.1 Developing a New Thermal Paradigm for Gallium Nitride (GaN) Device Technology

      John Blevins, Air Force Research Laboratory (AFRL), Wright-Patterson AFB, OH
      Glen Via, AFRL
      A. Bar-Cohen, Air Force Research Laboratory (AFRL), Defense Advanced Research Projects Agency (DARPA) Booz Allen Hamilton
      A Sivananthan, Booz-Allen-Hamilton
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    • 7a.2 GaN Unleashed: The Benefits of Microfluidic Cooling

      John Ditri, Lockheed Martin
      Robert Pearson, Lockheed Martin
      Roland Cadotte, Lockheed Martin
      David Fetterolf, Lockheed Martin
      Michael McNulty, Lockheed Martin
      Denise Luppa, Lockheed Martin
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    • 7a.3 GaN on Diamond: Pushing the Boundaries of Conventional MMIC Design and Fabrication

      D. Altman
      Matthew Tyhach, Raytheon Company
      V. Kaper
      J. Sanctuary
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    • 7a.4 GaN MMIC Impingement Jet Cooled Embedded Diamond

      V, Gambin, Northrop-Grumman (AS), Redondo Beach, CA
      Benjamin Poust
      Dino Ferizovic, Northrop Grumman Aerospace Systems
      Monte Watanabe, Northrop Grumman Aerospace Systems
      Gary Mandrusiak, GE Global Research
      Thomas Dusseault
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    • 7a.5 Near Junction Thermal Transport and Embedded Cooling of High Power GaN Electronics

      Carlton Creamer, BAE Systems Inc
      P. C. Chao, MEC, BAE Systems, IQE
      K K Chu, BAE Systems
      A Kassinos, BAE Systems
      G Campbell, Science Research Laboratories, Inc.
      H Eppich, Science Research Laboratories, Inc.
      A Shooshtari, University of Maryland
      S Dessiatoun, University of Maryland
      M Ohadi, University of Maryland
      C McGray, Modern Microsystems
      R Kallaher, Modern Microsystems
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