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Explore
Our Mission
Board of Directors
Executive Committee
Technical Program Committee
2022 Conference Collage
Sponsors
Exhibitor
Authors
Digests
Contact
Simulation of the Impact of Through-Substrate Vias on the Thermal Resistance of Compound Semiconductor Devices
Rajesh Baskaran, MACOM Technology Solutions Inc.
Allen W. Hanson, MACOM Technology Solutions Inc.
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