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Explore
Our Mission
Board of Directors
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2022 Conference Collage
Sponsors
Exhibitor
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Contact
Attendee/Exhibitor Registration
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Simulation of the Impact of Through-Substrate Vias on the Thermal Resistance of Compound Semiconductor Devices
Rajesh Baskaran, MACOM Technology Solutions Inc.
Allen W. Hanson, MACOM Technology Solutions Inc.
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