Determination of reliability performance over time requires an accurate understanding of device junction temperature, not only in customer use condition, but also during production test and burn-in. Through carefully designed and executed LIV (L=Light, I=current, V=Voltage) measurements and a modeling framework where optical power, thermal and electrical device parameters are interrelated, the laser diode junction temperature, as confirmed by wavelength shift measurements, is obtained via regression of a non-linear self-consistent equation. Modeled parameters include both threshold current and slope efficiency junction linear temperature dependence coefficients/constants, as well as a thermal impedance factor.
Charles Recchia
MACOM Technology Solutions
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Laser Diode Junction Temperature Assessment for Reliability Optimization
Malcolm Green, MACOM Technology SolutionsCharles Recchia, MACOM Technology SolutionsMark Bachman, MACOM Technology SolutionsLihua Hu, MACOM Technology SolutionsWolfgang Parz, MACOM Technology SolutionsDownload Paper