Malcolm Green

MACOM Technology Solutions
  • Laser Diode Junction Temperature Assessment for Reliability Optimization

    Malcolm Green, MACOM Technology Solutions
    Charles Recchia, MACOM Technology Solutions
    Mark Bachman, MACOM Technology Solutions
    Lihua Hu, MACOM Technology Solutions
    Wolfgang Parz, MACOM Technology Solutions

    Determination of reliability performance over time requires an accurate understanding of device junction temperature, not only in customer use condition, but also during production test and burn-in. Through carefully designed and executed LIV (L=Light, I=current, V=Voltage) measurements and a modeling framework where optical power, thermal and electrical device parameters are interrelated, the laser diode junction temperature, as confirmed by wavelength shift measurements, is obtained via regression of a non-linear self-consistent equation.  Modeled parameters include both threshold current and slope efficiency junction linear temperature dependence coefficients/constants, as well as a thermal impedance factor.

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