V. Dragoi

EV Group
  • Heterogeneous Integration Schemes of Compound Semiconductors for Advanced CMOS and More-than-Moore Applications

    T. Uhrmann, EV Group
    T. Matthias, EV Group
    T. Glinsner
    V. Dragoi, EV Group
    T. Plach
    E. Pabo
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  • May 12, 2022 // 3:20pm

    18.18 Reduction in Thermal Boundary Conductance of Annealed Direct Wafer Bonded GaN|Si Heterojunction Interfaces

    K. Huynh, University of California, Los Angeles
    M. E. Liao, University of California, Los Angeles, CA USA
    V. Dragoi, EV Group
    Eric Guiot, SOITEC
    Raphael Caulmilone, SOITEC
    M.S. Goorsky, University of California, Los Angeles, CA USA
    X. Yan, University of California Irvine
    T. Pfeifer, University of Virginia Charlottesville
    N. Razek, EV Group and R-Ray Medical
    X. Pan, Soitec
    P. E. Hopkin, University of Virginia Charlottesville
    J. Tomko, University of Virginia Charlottesville

    Student Presentation

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