Invited Presentation
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SESSION 12: INTEGRATION & PACKAGING
Chair: Andy Carter, Teledyne and Anita Pacheco, QorvoSan Carlos III-IV-
May 11, 2022 // 4:20pm
12.1 Micro-Transfer Printing for Micro-Assembly of Heterogeneous Integrated Compound Semiconductor Components
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May 11, 2022 // 4:50pm
12.2 Differences in SiC Wafer Thermal Conductivity from Face-to-Face Dependent on Polishing
Download PaperStudent Presentation
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May 11, 2022 // 5:10pm
12.3 A Novel Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications
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May 11, 2022 // 5:30pm
12.4 Novel thermoreflectance-based method for in-situ die attach thermal conductivity assessment in packaged devices
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