This work characterizes the effects of gate-length (LG) scaling in a self-aligned gate (SAG) β-Ga2O3 MOSFET process. Additional performance gains are expected by extending the SAG process from large LG to sub-micrometer dimensions. This data incorporates LG scaling down to 200 nm to improve device performance in Ga2O3 SAG MOSFETs using a stepper lithography process to define sub-micron gate lengths.
Kevin Leedy
Air Force Research Laboratory, Sensors Directorate
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Self-Aligned Refractory Metal Gate Scaling in β-Ga2O3 MOSFETs
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7.3.2023 Scaled ?-Ga2O3 MOSFETs with Pulsed Laser Deposition-Regrown Ohmics
Daniel M. Dryden, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USAHyung Min Jeon, KBR Inc.,Kyle Liddy, Air Force Research LaboratoryAhmad Islam, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USADennis E. Walker Jr., Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,Jeremiah C. Williams, Air Force Research Laboratory, Sensors DirectorateNicholas P. Sepelak, KBR, Air Force Research Laboratory Sensors Directorate, WPAFB, OH, USANolan S. Hendricks, Air Force Research Laboratory, Sensors DirectorateKevin Leedy, Air Force Research Laboratory, Sensors DirectorateKelson Chabak, Air Force Research Laboratory, Sensors DirectorateAndrew J. Green, Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH,