Digests - CS MANTECH Conference CS MANTECH Conference

SESSION 1: PLENARY

Chair: Martin Kuball, University of Bristol & David Meyer, Naval Research Laboratory
- 1.1.2023 Digitization and Edge Processing Redefine the Roles of Semiconductor and Packaging Technologies for Future Defense Platforms
  
  John Cowles, Analog Devices
  
  1.1 Digitization and Edge Processing Redefine the Roles of Semiconductor and Packaging Technologies for Future Defense Platforms
- 1.2.2023-DoD Microelectronics: Heterogeneous Integration with Compound Semiconductors and Photonics
  
  Devanand Shenoy, Office of the Under Secretary of Defense for Research and Engineering, Washington, DC
  
  Darren Crum, Naval Surface Warfare Center Crane
  
  Brian Olson, Naval Surface Warfare Center Crane
  
  Joshua Hawke, Naval Surface Warfare Center Crane
  
  1.2.2023-Shenoy_1.2_CS_MANTECH-Final-Paper-Feb-2023_v6
- 1.3.2023 Merits and Challenges of MicroLED Technology
  
  Khaled Ahmed, Intel Corporation
  
  1.3.2023-CS_MANTECH – Merits and Challenges of MicroLED Technology
- 1.4.2023 Production of High-Reliability 150mm GaN HEMT for 5G Base Station
  
  Kazuaki Matsuura, Sumitomo Electric Device Innovations USA
  
  T. Watanabe, Sumitomo Electric Device Innovations Japan
  
  T. Kosaka, Sumitomo Electric Device Innovations, Japan
  
  S. Kitajima, Sumitomo Electric Device Innovations, Japan
  
  P. Mushini, Coherent Corp.
  
  J. Bellotti, Coherent Corp.
  
  G. Gedzberg, Coherent Corp.
  
  1.4.2023-Kazuaki Matsuura_Production of High-Reliability 150mm GaN HEMT for 5G Base Station (final)

SESSION 1: PLENARY

1.1.2023 Digitization and Edge Processing Redefine the Roles of Semiconductor and Packaging Technologies for Future Defense Platforms

1.2.2023-DoD Microelectronics: Heterogeneous Integration with Compound Semiconductors and Photonics

1.3.2023 Merits and Challenges of MicroLED Technology

1.4.2023 Production of High-Reliability 150mm GaN HEMT for 5G Base Station